main feature:
l Adapt to high-precision SMT process requirements；
l Excellent wettability and continuous printing,suitable for placement of fine pitch devices (QFP, etc.).
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency
l high adhesion, keep the components attached
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent.；
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l Adapt to high-precision SMT process requirements；
l Excellent wettability and continuous printing,suitable for placement of fine pitch devices (QFP, etc.)
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robustreflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces；
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent.
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l Use tin-bismuthhigh-temperature solder powder for soldering electronic components forhigh-temperature work or circuit boards or integrated modules requiringsecondary reflow soldering；
l ? Strongmoisturizing ability, good solder wettability to various devices and pads.
Wide process window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
