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      MINI-LED package soldering

      Compared with the traditional SMT printing process, Mini--LED has the highest requirements on the process. According to statistics, more than 60% of the soldering defects are caused by the printing process. For the precision printing of Mini-LED, the equipment (printing machine) The accessories (steel mesh) and materials (solder paste) all put forward higher requirements, and the three are indispensable.

      EM-6001 series solid crystal solder paste developed by Morning Technology for Mini LED printing process technology, using ultra-fine, narrow particle size distribution, high sphericity, low oxygen content Sn96.5Ag3Cu0.5 tin powder and ROL0 grade solder paste It has good printing property and mold release property under fine pitch pad size. After reflow soldering, there are few residues, no corrosiveness, full solder joints, no collapsing and solder bridge short circuit, which meets high precision and high reliability. Sexual electrical parameters are required, and the SPI online detection has a low defect rate, which can effectively improve the production yield of the product.

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